Flip chip packaging equipment
Visual inspection equipment
Core technologies: chip pickup, alignment technology, chip loading process control (temperature / pressure / height), yield control technology
Core technologies: chip pickup, alignment technology, chip loading process control (temperature / pressure / height), yield control technology
产品描述
» support JEDEC pallet to JEDEC pallet
» up to 70000
» support BGA, GW and QFN chip sizes from 3x3mm to 50X50mm
» automatically set spacing splice
» avoid lamination and have 3D sidewall inspection function
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Address: Zone A, plant d2-3, Saida international industrial city, Xiqing Economic and Technological Development Zone, Tianjin
Tel: 022-87829334
E-mail：admin@lz-semi.com
Address: No. 268, Chunyuan Road, juanzhou District, Ningbo, Zhejiang
Tel: 0574-88328930
E-mail：xxxx@tangrentech.cn
Address: Floor 2, plant 3, No. 99, Xinda Road, Huimin street, Jiashan County, Jiaxing City, Zhejiang Province
Tel: 022-87829334
E-mail：xxxx@tangrentech.cn
Address: Jiashan County, Jiaxing City, Zhejiang Province
Tel: 022-87829334
E-mil：xxxx@tangrentech.cn
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Jin ICP Bei No. 2021007633