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Emergency treatment of faulty soldering of BGA packaging IC

时间:2021-11-23 类型:Corporate News

Now more and more high-density, high-performance, multi pin large-scale integrated circuits use ball grid array packaging, referred to as BGA. Most of these integrated circuits are high-speed processing and high-power processors, decoders and so on. Since the pin of BGA chip is directly below the chip, and the chip pin of BGA package is connected with the circuit board pad with tin ball beads, the chip heating causes the chip pin to be disconnected from the circuit board pad of Xizhu River, which can not be repaired by ordinary electric soldering iron. The best way to repair the chip is to reset the solder ball and re weld it with BGA welding table, but the general repairer does not necessarily have this equipment. Using hot air gun to blow weld the chip has a certain risk, but if used properly, the chip and circuit board can be re welded. Emergency treatment methods for faulty soldering of BGA packaged integrated circuits under amateur conditions:


1. Solder paste must be used to remove the oxide on the surface of the device, reduce the surface tension of solder and better fuse the solder bead with the pad. The solder paste must be neutral and non corrosive. The paste body is a light yellow% color viscous material. Apply the paste body around the chip with a screwdriver, and then heat the solder paste around the chip with a hot-air gun at a low temperature to make it flow directly below the chip (move the circuit board in four directions during heating, and more solder paste infiltrates the solder ball several times).


2. When heating the chip with a hot air gun, it is recommended to use a medium and high temperature gear. During heating, the air duct blows and welds the chip vertically downward. The air duct can move around the circumference of the chip substrate at a uniform speed clockwise or counterclockwise, so as to heat the parts other than the silicon wafer in the middle of the chip evenly. The control of heating time is the key: the time is too short, the tin beads are not melted, and the welding is poor; If the heating time is too long, the tin bead is easy to burst, resulting in short circuit between pins and damaging the chip. Therefore, observe the reaction of the solder paste. If a small amount of blue smoke comes out, it means that the solder paste will boil and evaporate, and the heating should be stopped immediately.


3. Press a screwdriver in the middle of the chip and apply a certain pressure to make the solder bead in good contact with the chip and circuit board. It can be released only after the temperature is reduced (touching the chip by hand is not hot). After this treatment, the machine may be repaired.


Note: do not directly blow the silicon wafer in the middle of the chip. You can heat the substrate around the chip. The heating time must be well controlled.

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