Flip chip packaging equipment
Test sorting equipment
Core technologies: chip pickup, alignment technology, chip loading process control (temperature / pressure / height), yield control technology
Core technologies: chip pickup, alignment technology, chip loading process control (temperature / pressure / height), yield control technology
产品描述
» wafer to tape
» speeds up to 45000 per hour
» chip size 0.2x0.4mm to 8x8mm
» chip crack inspection function
» from reel to reel, supporting multi chip operation
» with automatic tape change function
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Address: Zone A, plant d2-3, Saida international industrial city, Xiqing Economic and Technological Development Zone, Tianjin
Tel: 022-87829334
E-mail：admin@lz-semi.com
Address: No. 268, Chunyuan Road, juanzhou District, Ningbo, Zhejiang
Tel: 0574-88328930
E-mail：xxxx@tangrentech.cn
Address: Floor 2, plant 3, No. 99, Xinda Road, Huimin street, Jiashan County, Jiaxing City, Zhejiang Province
Tel: 022-87829334
E-mail：xxxx@tangrentech.cn
Address: Jiashan County, Jiaxing City, Zhejiang Province
Tel: 022-87829334
E-mil：xxxx@tangrentech.cn
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Jin ICP Bei No. 2021007633