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Visual inspection equipment

Core technologies: chip pickup, alignment technology, chip loading process control (temperature / pressure / height), yield control technology

产品描述

» it has 2D / 3D inspection function and supports free switching


» support JEDEC pallet to JEDEC pallet / reel


» up to 18000


» support the inspection of lead-free, GW and BGA packages


» ball diameter up to 150 μ m


» kit less conversion - automatic splicing


» advanced BPVI, open / short on / off test

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Lizhu intelligent equipment (Tianjin) Co., Ltd

Address: Zone A, plant d2-3, Saida international industrial city, Xiqing Economic and Technological Development Zone, Tianjin

Tel: 022-87829334

E-mail:admin@lz-semi.com

Tangren manufacturing (Ningbo) Co., Ltd

Address: No. 268, Chunyuan Road, juanzhou District, Ningbo, Zhejiang                 

Tel: 0574-88328930

E-mail:xxxx@tangrentech.cn

Tang Mingsheng Test Technology (Jiashan) Co., Ltd

Address: Floor 2, plant 3, No. 99, Xinda Road, Huimin street, Jiashan County, Jiaxing City, Zhejiang Province

Tel: 022-87829334

E-mail:xxxx@tangrentech.cn

Tangren manufacturing (Jiashan) Co., Ltd

Address: Jiashan County, Jiaxing City, Zhejiang Province

Tel: 022-87829334

E-mil:xxxx@tangrentech.cn

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Copyright © 2021 Lizhu intelligent equipment (Tianjin) Co., Ltd

Jin ICP Bei No. 2021007633