Classification and characteristics of welding materials in SMT patch processing

Solder in SMT chip processing can be divided into tin lead solder, silver solder and copper solder according to their components. According to the humidity of the use environment, it can be divided into high-temperature solder (solder used at high temperature) and low-temperature solder (solder used at low temperature). In order to ensure the welding quality, it is important to select different solders according to the different objects to be welded. In the assembly of electronic products, tin lead series solder, also known as solder, is generally selected.